[Intelligent Desoldering] Advanced temperature control prevents motherboard damage, with an alarm system to avoid overheating [Large Operating Area] Supports desoldering operations on larger motherboards, offering excellent compatibility and efficiency [Precise Temperature Management] Clear temperature display with adjustable controls for optimal performance [Rapid Heating Technology] Features fast temperature rise, long lifespan, and uniform heat distribution for efficient operations [Versatile Compatibility] Supports separation of Android and iPhone X-15PM series motherboards, screen brackets, with continuous updates for future models [Innovative Design] Strong magnetic adsorption with multiple built-in magnets for easy handling and disassembly [Enhanced Fit] Synthetic stone compression clasp ensures better motherboard fitting during operations Specifications: Heating Area: Extra large, suitable for Android phones and larger motherboards Temperature Control: Precise, with adjustable settings Display: Temperature readout Alarm System: Audible alert when preset temperature is reached Compatibility: Android and iPhone X-15PM series motherboards Design Features: Magnetic adsorption, no snaps Additional Feature: Synthetic stone compression clasp Heat Dissipation: Improved air duct design for better cooling