Features: brand new and high quality Mobile phone composite even heat plate: fast cooling uniform heat dissipation, increase the heat dissipation area, accelerate the speed of heat dissipation. Semiconductor cooling & large area heat sink: for cell phone hotspot, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat dissipation effect. Strong adhesive - not fall off: strong adhesive, firmly adsorbed, no need to worry about radiator fall. Thin and light experience:The thickness is only 3mm, closely fit the phone. With silicone for protection, do not hurt the phone:easy to take and easy to paste, with silicone for protection, soft and do not hurt the machine. Specifications: Material: ABS/Conductive iron sheet Size: approx. 59.4mm/2.33in , 53.6mm/2.11in(optional) Category :Magnetic (universal magnetic models and back clip models heat sink use, the back of the material double-sided adhesive) Note: 1.No retail package. 2.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid. 3.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package includes: 1PC x Mobile Phone Cooling Plate